Harvatek Corp. v. Nichia Corp. - Complaint

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 1 of 9 PageID #: 1

IN THE UNITED STATES DISTRICT COURT FOR THE EASTERN DISTRICT OF TEXAS TYLER DIVISION

HARVATEK CORPORATION, Plaintiff, v. NICHIA CORPORATION AND NICHIA AMERICAN CORPRATION,
Defendants.

Civil Action No. 6:13-cv-901 JURY TRIAL DEMANDED

ORIGINAL COMPLAINT FOR PATENT INFRINGEMENT This is an action for patent infringement in which Harvatek Corporation (“Harvatek” or “Plaintiff”) makes the following allegations against Nichia Corporation (“Nichia Corp.”) and Nichia America Corporation (“Nichia America”) (collectively, “Defendants”): PARTIES 1. Plaintiff Harvatek is a Taiwanese corporation, with its principal place of business

located at No.18, Lane 522, Sec.5, Chung Hwa Road, Hsinchu City 30094, Taiwan (R.O.C.). 2. Harvatek was founded in 1995 in Hsinchu, Taiwan. The company is principally

engaged in the research, development, design, and manufacturer of seminconductor chips and light emitting diode (LED) packages. Harvatek’s products are used as luminous sources for communication products, information technology products, household appliances, automobiles, security products, among others. 3. On information and belief, Defendant Nichia Corp. is a corporation organized

under the laws of Japan with its principal place of business at 491 Oka, Kaminaka-Cho, Anan-

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 2 of 9 PageID #: 2

Shi, TOKUSHIMA 774-8601, Japan. On information and belief, Nichia Corp. may be served via office or director at the above address. 4. On information and belief, Nichia America is a subsidiary of Nichia Corp. and a

corporation organized under the laws of the state of Michigan with its principle place of business at 48561 Alpha Drive, Ste. 100, Wixom, MI 48393. Nichia America may be served via its registered agent: Susumu Wako, 48561 Alpha Drive., Ste. 100, Wixom, MI 48393. JURISDICATION AND VENUE 5. This action arises under the patent laws of the United States, Title 35 of the

United States Code. This Court has subject matter jurisdiction pursuant to 28 U.S.C. §§ 1331 and 1338(a). 6. Venue is proper in this district under 28 U.S.C. §§ 1391(c) and 1400(b). On

information and belief, each Defendant has transacted business in this district, and has committed and/or induced acts of patent infringement in this district. 7. On information and belief, each Defendant is subject to this Court’s specific and

general personal jurisdiction pursuant to due process and/or the Texas Long Arm Statue, due at  least to its substantial business in this forum, including: (i) at least a portion of the infringements alleged herein; and (ii) regularly doing or soliciting business, engaging in other persistent courses of conduct, and/or deriving substantial revenue from goods and services provided to individuals in Texas and in this Judicial District. Furthermore, Nichia Corp has previously availed itself of the jurisdiction of this Court by bringing suit in the Eastern District of Texas.

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 3 of 9 PageID #: 3

COUNT I INFRINGEMENT OF U.S. PATENT NO. 6,008,529 8. Plaintiff is the owner by assignment of United States Patent No. 6,008,529 (“the

’529 Patent”) titled “Laser Diode Package.” The ’529 Patent issued on December 28, 1999. A true and correct copy of the ’529 Patent is attached as Exhibit A. 9. Upon information and belief, Defendants directly or through intermediaries have

been and are now infringing the ’529 Patent in the State of Texas, in this judicial district, and elsewhere in the United States, by, making, using, providing, supplying, distributing, selling, and/or offering for sale products and/or systems (including at least its model numbers NCSU034B, NCSU033B, NSSU123, NSSU100D, and NSSU100C) that includes a package comprising, a substrate on which a laser diode is mounted on, a first and second plated-through conduit each having one end connected to a first and second bonding pad and another end connected to a first and second circuit contact as covered by one or more claims of the ’529 Patent. Defendants are directly infringing, literally infringing, and/or infringing the ’529 Patent under the doctrine of equivalents. Defendants are thus liable for infringement of the ’529 Patent pursuant to 35 U.S.C. § 271. 10. On information and belief, to the extent any marking was required by 35 U.S.C.  §

287, all predecessors in interest to the ’529 Patent complied with any such requirements. 11. As a result of Defendants’ infringement of the ’529 Patent, Plaintiff has suffered

monetary damages and is entitled to a money judgment in an amount adequate to  compensate for Defendants’ infringement, but in no event less than a reasonable royalty for the  use made of the invention by Defendants, together with interest and costs as fixed by the court,  and Plaintiff will continue to suffer damages in the future unless Defendants’ infringing activities  are enjoined by this Court.

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 4 of 9 PageID #: 4

12.

Unless a permanent injunction is issued enjoining Defendants and their agents, 

servants, employees, representatives, affiliates, and all others acting on in active concert  therewith from infringing the ’529 Patent, Plaintiff will be greatly and irreparably harmed. COUNT II INFRINGEMENT OF U.S. PATENT NO. 6,300,674 13. Plaintiff is the owner by assignment of United States Patent No. 6,300,674 (“the

’674 Patent”) titled “Flat Package for Semiconductor Diodes.” The ’674 Patent issued on October 9, 2001. A true and correct copy of the ’674 Patent is attached as Exhibit B. 14. Upon information and belief, Defendants directly or through intermediaries have

been and are now infringing the ’674 Patent in the State of Texas, in this judicial district, and elsewhere in the United States, by, making, using, providing, supplying, distributing, selling, and/or offering for sale products and/or systems (including at least its model numbers NSSM032, NSSM227A, NSSW064A, NSSB064, NSSR064, NESW064A, NESL064A, NESB064, NESG064, NESA064, NHSW064, NHSL064, NHSB064, NHSG064, NSSW063A,

NHSW046A, NHSB046A,

NHSW046, NHSL046, NHSB046, NHSG046, NHSA046, and

NHSW046H) that includes a flat package comprising, a semiconductor diode with a top and bottom surface and two electrodes, two contact pads for electrically connecting with the package, and a protective glue covering the diode and contact pads as covered by one or more claims of the ’674 Patent. Defendants are directly infringing, literally infringing, and/or infringing the ’674 Patent under the doctrine of equivalents. Defendants are thus liable for infringement of the ’674 Patent pursuant to 35 U.S.C. § 271. 15. On information and belief, to the extent any marking was required by 35 U.S.C.  §

287, all predecessors in interest to the ’674 Patent complied with any such requirements.

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 5 of 9 PageID #: 5

16.

As a result of Defendants’ infringement of the ’674 Patent, Plaintiff has suffered

monetary damages and is entitled to a money judgment in an amount adequate to  compensate for Defendants’ infringement, but in no event less than a reasonable royalty for the  use made of the invention by Defendants, together with interest and costs as fixed by the court,  and Plaintiff will continue to suffer damages in the future unless Defendants’ infringing activities  are enjoined by this Court. 17. Unless a permanent injunction is issued enjoining Defendants and their agents, 

servants, employees, representatives, affiliates, and all others acting on in active concert  therewith from infringing the ’674 Patent, Plaintiff will be greatly and irreparably harmed. COUNT III INFRINGEMENT OF U.S. PATENT NO. 6,841,934 18. Plaintiff is the owner by assignment of United States Patent No. 6,841,934 (“the

’934 Patent”) titled “White Light Source from Light Emitting Diode.” The ’934 Patent issued on January 11, 2005. A true and correct copy of the ’934 Patent is attached as Exhibit C. 19. Upon information and belief, Defendants directly or through intermediaries have

been and are now infringing the ’934 Patent in the State of Texas, in this judicial district, and elsewhere in the United States, by, making, using, providing, supplying, distributing, selling, and/or offering for sale products and/or systems (including at least its model numbers NFSW157A, NFSW157A-H3, NS2W157AR, NS2W157AR-H3, NSSW157A, NSSW157-H3, NESW157B, NHSW157B, NSSW757A-V1, NS2W757A-V1, NF2W757AR-V1, NVSW119B, NVSW219B, NJSW172, NFSW172, NSSW064A, NESW064A, NHSW064, NSSW063A, NHSW046A, NHSW046, NHSW046H, NSSW088A, NSSW129, NNSW208C, NSSW206C, NSSW204C, NS2W157BR, NSSW157B, NESW157B, NF2W557BR, and NS2W557BR) that include a light emitting diode, having a light emitting diode chip, a bottom electrode, a second

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 6 of 9 PageID #: 6

electrode, emitting a short wavelength color light, a split metal substrate with a first and second metal sections, connected to the first and second electrodes, a fluorescent glue covering the LED chip converting the short wavelength color light into white light, and terminals for said LED formed by the outer ends of the first and second metal section, not covered by said fluorescent glue as covered by one or more claims of the ’934 Patent. Defendants are directly infringing, literally infringing, and/or infringing the ’934 Patent under the doctrine of equivalents. Defendants are thus liable for infringement of the ’934 Patent pursuant to 35 U.S.C. § 271. 20. On information and belief, to the extent any marking was required by 35 U.S.C.  §

287, all predecessors in interest to the ’934 Patent complied with any such requirements. 21. As a result of Defendants’ infringement of the ’934 Patent, Plaintiff has suffered

monetary damages and is entitled to a money judgment in an amount adequate to  compensate for Defendants’ infringement, but in no event less than a reasonable royalty for the  use made of the invention by Defendants, together with interest and costs as fixed by the court,  and Plaintiff will continue to suffer damages in the future unless Defendants’ infringing activities  are enjoined by this Court. 22. Unless a permanent injunction is issued enjoining Defendants and their agents, 

servants, employees, representatives, affiliates, and all others acting on in active concert  therewith from infringing the ’934 Patent, Plaintiff will be greatly and irreparably harmed. COUNT IV INFRINGEMENT OF U.S. PATENT NO. D659,655 23. Plaintiff is the owner by assignment of United States Patent No. D659,655 (“the

’655 Patent”) titled “Led Package Base.” The ’655 Patent issued on May 15, 2012. A true and correct copy of the ’655 Patent is attached as Exhibit B.

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 7 of 9 PageID #: 7

24.

Upon information and belief, Defendants directly or through intermediaries have

been and are now infringing the ’655 Patent in the State of Texas, in this judicial district, and elsewhere in the United States, by, making, using, providing, supplying, distributing, selling, and/or offering for sale products and/or systems (including at least its model numbers NNSW208C, NNSW206C, and NNSW204C) which embody the design covered by the ’655 Patent. 25. Defendants’ products including at least its model numbers NNSW208C,

NNSW206C, and NNSW204C) infringe the ’655 Patent because they include substantially the same design elements as claimed and shown in at least Figures 1-3, and 6-8 of the ’655 Patent. The Accused Products include substantially the same packaging elements as shown and claimed in the ’655 Patent 26. On information and belief, to the extent any marking was required by 35 U.S.C.  §

287, all predecessors in interest to the ’655 Patent complied with any such requirements. 27. As a result of Defendants’ infringement of the ’655 Patent, Plaintiff has suffered

monetary damages and is entitled to a money judgment in an amount adequate to  compensate for Defendants’ infringement, but in no event less than a reasonable royalty for the  use made of the invention by Defendants, together with interest and costs as fixed by the court,  and Plaintiff will continue to suffer damages in the future unless Defendants’ infringing activities  are enjoined by this Court. 28. Unless a permanent injunction is issued enjoining Defendants and their agents, 

servants, employees, representatives, affiliates, and all others acting on in active concert  therewith from infringing the ’655 Patent, Plaintiff will be greatly and irreparably harmed.

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 8 of 9 PageID #: 8

PRAYER FOR RELIEF WHEREFORE, Plaintiff respectfully requests that this Court enter: 1. A judgment in favor of Plaintiff that Defendants have infringed the ’674, ’934,

and ’655 Patents; 2. A permanent injunction enjoining Defendants and their officers, directors, agents

servants, affiliates, employees, divisions, branches, subsidiaries, parents, and all others acting in  active concert therewith from infringement, inducing the infringement of, or contributing to the  infringement of the ’674, ’934, and ’655 Patents, or such other equitable relief the Court determines is warranted; 3. A judgment and order requiring Defendants pay to Plaintiff its damages, costs, 

expenses, and prejudgment and post-judgment interest for Defendants’ infringement of the ’674, ’934, and ’655 Patents as provided under 35 U.S.C. § 284, and an accounting of ongoing postjudgment infringement; and 4. entitled. DEMAND FOR JURY TRIAL Plaintiff, under Rule 38 of the Federal Rules of Civil Procedure, requests a trial by jury of  any issues so triable by right. Any and all other relief, at law or equity, to which Plaintiff may show itself to be 

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 9 of 9 PageID #: 9

DATED November 22, 2013

Respectfully submitted, By: \s\ Hao Ni Hao Ni Texas Bar No. 24047205 [email protected] Timothy T. Wang Texas Bar No. 24067927 [email protected] Neal G. Massand Texas Bar No. 24039038 [email protected] Stevenson Moore V Texas Bar No. 24076573 [email protected] Ni, Wang & Associates, PLLC 8140 Walnut Hill Ln., Ste. 310 Dallas, TX 75231 Tel: (972) 331-4600 Fax: (972) 314-0900 ATTORNEYS FOR PLAINTIFF HARVATEK CORPORATION

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 1 of 12 PageID #: 10

Exhibit A

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 2 of 12 PageID #: 11
US006008529A

Ulllted States Patent [19]
Wu
[54] LASER DIODE PACKAGE

[11] Patent Number:
[45] Date of Patent:

6,008,529
Dec. 28, 1999

Attorney, Agent, or Firm—H. C. Lin, Patent Agent

[75] Inventor: J iahn-Chang Wu, Hsin-Chu, Taiwan
[73]
[21] [22]
[51] [52]

[57]

ABSTRACT

Assignee: Bily Wang, Hsin-Chu, Taiwan
Appl- NO-I 09/ 104,762 Filed. Jun 25 1998
. . ,

A surface mount semiconductor laser diode package has a
substrate on which the laser diode is mounted. The top

electrode of the laser diode is wire-bonded to the top end of a plated-through conduit through the substrate, and the
bottom end of the plated-through conduit is connected to a Circuit Contact plated at the bottom Surface of the substrate' The bottom electrode Ofthe laser diode is ?ip_chip mounted

6
Int. Cl. ........................ .. H01L 23/495; H01L 23/02 US. Cl. ........................ .. 257/676; 257/678;

[58] Field of Search ................................... .. 257/676, 678,
257/698, 670, 99, 787, 100, 778
[56] References Cited

to ghefto? end of gnoltheiiplgted-t?rougg (foridult’ and bgttom
en 0 t e secon p ate -t roug con u1t~1s connecte 'to a
second circuit contact. Each laser diode is covered With a transparent lid or a lid with a lens. For mass production, a

US‘ PATENT DOCUMENTS
5,220,195 5,629,952 6/1993 McShane et al. ..................... .. 257/666 5/1997 Bartholomew et al. 257/678

large number of the laser diodes arranged in a matrix
formation are mounted on a common substrate. Walls are

erected around each laser diode' A transparent Cover is _

576897091 11/1997 Hamzehdoost et aL
5,767,528 6/1998 Suni et a1, ,,,,,,,,,,,,, ,,

257/700
257/778

placed over the walls. All the plated-through conduits at the
edges of the laser diodes in a same column are aligned and

5,773,879

6/1998 Fusayasu et al.

.. 257/678

sawed through togethen

Primary Examiner—Mahshid Saadat
Assistant Examiner—Jhihan B Clark

15 Claims, 8 Drawing Sheets

5 32
36P

l I
l_ — _ _ — _ _ -l

38F

30W

30

36 38

I
36F —-"

I
32

'/
__ 38F

36B

38B

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 3 of 12 PageID #: 12

U.S. Patent

Dec. 28, 1999

Sheet 1 of8

6,008,529

Fig. 1A.

Fig. 1B.

16P

__—____-J

18F

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 4 of 12 PageID #: 13

U.S. Patent

Dec. 28, 1999

Sheet 2 of8

6,008,529

Fig. 2A.

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 5 of 12 PageID #: 14

U.S. Patent

Dec. 28, 1999

Sheet 3 of8

6,008,529

Fig. 2B.

26 26P

28
28P

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 6 of 12 PageID #: 15

U.S. Patent

Dec. 28, 1999

Sheet 4 of8

6,008,529

Fig. 2C.

Fig. 2D.
282 28

C36

® © 6G )

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 7 of 12 PageID #: 16

U.S. Patent

Dec. 28, 1999

Sheet 5 of8

6,008,529

Fig. 3A.

36P

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 8 of 12 PageID #: 17

U.S. Patent

Dec. 28, 1999

Sheet 6 of8

6,008,529

Fig. 3C.
30W 36 38 39

32

__ 38F

36B

38B

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 9 of 12 PageID #: 18

U.S. Patent

Dec. 28, 1999

Sheet 7 of8

6,008,529

Fig. 4A.

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 10 of 12 PageID #: 19

U.S. Patent

Dec. 28, 1999

Sheet 8 of8

6,008,529

48F

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 11 of 12 PageID #: 20

6,008,529
1
LASER DIODE PACKAGE
BACKGROUND OF THE INVENTION

2
bonding pad on top of the substrate 12. The a second bottom

electrode E2 is ?ip-chip bonded to another conducting
This invention is related to a semiconductor package, in particular to a surface mount package for a laser diode. Conventional laser diode package has a an metallic eXte

bonding pad on the substrate 12. The side Wall 15 and a transparent cover 28 encloses the laser diode 10 to constitute a single laser diode unit. FIG. 1B shoWs the surface of the substrate 12 for the structure shoWn in FIG. 1A. The substrate 12 has a bonding

rior and the terminals are protruded outside the package. The

package occupies a large volume, Which is undesirable.
SUMMARY

pad 16 printed on top of the substrate 12. The bonding pad
16 is Wire bonded to the top electrode E1 and fed through a plated-through conduit 16P to a circuit contact at the bottom of the substrate 12 serving as a ?rst output terminal. The

An object of this invention is to miniaturiZe a surface

mount laser diode package. Another object of this invention
is to provide a laser diode package suitable for mass pro duction.
15

bottom electrode E2 of the laser diode is ?ip-chip bonded to another bonding pad 18 Which is also connected to the

bottom of the substrate 12 through another plated-through
hole 18P to another circuit contact at the bottom of the

These objects are achieved by providing tWo plated
through conduits through a substrate on Which the laser

diode is mounted. One plated-through conduit has its top end eXtended to a bonding pad to Which the top electrode of the laser diode is Wire-bonded, and its bottom end connected to
a circuit contact at the bottom of the substrate. Another

substrate 12, serving as the second output terminal of the laser diode. FIG. 2A shoWs a layout for mass production of the laser
diodes of the present invention. A common substrate 22 is ?rst erected With side Walls 25 to separate a matriX of laser diodes 20. Each laser diode is glued to the substrate With conductive epoXy for ?ip-chip bonding to a common sub strate 22. The ?rst electrode E1 is Wire bonded by Wire 26W for connection to the bottom contact of the substrate 22.
Finally, a transparent cover is used to cover over the entire

plated-through conduit has its top end eXtended to another bonding pad to Which the bottom electrode of the laser diode is ?ip-chip bonded, and its bottom end connected to another
circuit contact at the bottom of the substrate. Each laser diode is enclosed With four Walls and covered With a
transparent lid or a lid With a lens. In mass production, a common substrate is used to mount
25

substrate, by gluing over the side Walls 25 to protect the
device from dust as shoWn in FIG. 2C. The structure is then

diced along the bands X1, X2, Y1, Y2 to yield a large
number of laser diodes. FIG. 28 shoWs the top vieW of the substrate 22 in mass

a matriX of laser diodes With the plated-through conduits aligned. Walls are ?rst erected and then covered With a

transparent lid. The structure is saWed through the plated through conduits along the same column and then saWed
roW by roW to yield individual dice.
BRIEF DESCRIPTION OF THE INVENTION
35

production. The substrate 22 has a large number of bonding
pads 26 for the ?rst electrodes E1, Which are connected to

the bottom contacts through the plated-through conduit 26P serving as the output terminals for the ?rst electrodes of the laser diodes. The top of the substrate 22 also has second

FIG. 1A shoWs the cross-sectional vieW of the laser diode package based on the present invention. FIG. 1B shoWs the top vieW of the package relative to the placement of the laser diode and the terminals on a substrate.
FIG. 2A shoWs a mass production arrangement of a matriX

bonding pads 28, each ?ip-chip bonded to the second electrode E2 of the laser diode and fed through the plated
through conduit 28P to the bottom of the substrate 22. The plated-through conduits Within each package as Well as all the packages along a same column are aligned for the

convenience of saWing.
FIG. 2C shoWs a transparent cover 28 for the mass

of the laser diode packages.
FIG. 2B shoWs the top vieW of the mass produced laser

produced laser diode packages. This cover rests on top of the

diode packages.
FIG. 2C shoWs a transparent cover for the mass produced

laser diode packages. After dicing, the cover is separated
into individual covers for the laser diode package.
45

laser diode package matriX.
FIG. 2D shoWs the cover for the laser diode matriX With

FIG. 2D shoWs a transparent cover 28 With lenses 282.

transparent lenses.
FIG. 3A shoWs the top vieW of the laser diode matriX With

These lenses serve to focus the light radiating from the laser diode. Conversely, the lenses can be defocusing lenses to

produce divergent light rays.
FIG. 3A shoWs a top vieW of a common substrate With

heating dissipating metal layer.
FIG. 3B shoWs an enlarged top vieW of a laser diode

package shoWn in FIG. 3A.
FIG. 3C shoWs a cross-sectional vieW of the laser diode

metallic coating for heat sinking. The substrate 32 contains a large number of bonding pads for a matriX of laser diodes. The top of the substrate 32 has bonding pads 36 for
connection to the ?rst electrodes of the laser diodes E1 Which are fed through plated-through conduits 36P to bot tom contacts of the substrate, serving as eXtended input terminals to E1. The top of the substrate 32 also has bonding pads 38 for connection to the second electrodes of the laser diodes E2 Which are fed through plated-through conduits 38P to other bottom contacts of the substrate 32, serving as eXtended input terminals to E2. This embodiment is different

package shoWn in FIG. 3B. FIG. 4A shoWs the top vieW of the laser diode matriX having the heating dissipating metal serving as an electrode. FIG. 4B shoWs the enlarged top vieW of the laser diode
matriX shoWn in FIG. 4A. FIG. 4C shoWs the cross-sectional vieW of the laser diode

55

package shoWn in FIG. 4B.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 1A shoWs the cross-sectional vieW of a laser diode package based on the present invention. A laser diode 10 has a top electrode E1 and a bottom electrode E2. The top electrode E1 is Wire bonded by Wire 16W to a conducting
65

from FIG. 2B in that the bonding pad 38 has relatively large
area for dissipating heat. FIG. 3B shoWs an enlarged vieW of one unit laser diode package shoWn in FIG. 3B. The top of the substrate 32 has a bonding pad 36 connected to the ?rst electrode E1 of the
laser diode 30 and eXtended to a bottom contact of the

substrate 32 through the plated-through conduit 36P serving
as the ?rst input terminal to the laser diode The top of the

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 12 of 12 PageID #: 21

6,008,529
3
substrate 32 also has a bonding pad 38 each ?ip-chip bonded
to the bottom E2 of the laser diode and extended to another

4
3. A surface mount package as described in claim 1,

Wherein said second bonding pad is ?ip-chip bonded to said
second electrode. 4. A surface mount package as described in claim 1,

bottom contact of the substrate 32 through plated-through
conduit 38P serving as a second extended input terminal to

E2. The bonding pad 38 has a relatively large area to better

heat sinking.
FIG. 3C is a cross-sectional vieW of FIG. 3B. This ?gure

Wherein said ?rst bonding pad and said second bonding pad
are plated ?at at the top surface of said substrate. 5. A surface mount package as described in claim 1, Wherein said second bonding pad has a large enough area to
serve as a heat sink.
10

shoWs hoW the ?rst bonding pad 36 is extended to the bottom side of the substrate 32 through the plated-through
conduit 36F to become circuit contact 36B. Similarly, the second bonding pad 38 is extended to the bottom of the

substrate 32 through the plated through conduit 38P to
become circuit contact 38B. FIG. 4A shoWs the heat dissipating metal on the substrate

6. A surface mount package for laser diode having a ?rst electrode on thptop surface of said diode and a second

electrode at the bottom surface of said diode, comprising,
a substrate on Which said laser diode is mounted on the

serving as an bonding pad. The substrate 42 is plated With a large number of bonding pads for a matrix of laser diodes 40. The bonding pads 46 are for the ?rst electrodes E1, Which is connected to the other side of the substrate 42 through the plated-through conduits 46P, serving as the ?rst extended

top surface of said substrate;
15

a ?rst plated-through conduit having a ?rst end connected

to a ?rst bonding pad for bonding to said ?rst electrode,
and a second end connected to a ?rst circuit contact at

input terminal. The substrate 42 also has bonding pads 48 for
the second electrodes E2, Which are connected to the other

the bottom of said substrate; second plated-through conduit having one end connected
to a second circuit contact at the bottom surface of said

side of the substrate 42 through the plated-through holes 48P, serving as the second extended input terminals. The
difference of this embodiment and that in FIG. 3A is that each plated-through hole 48P lies underneath the laser diode 40. FIG. 4B shoWs an enlarged vieW of a unit laser diode package shoWn in FIG. 4A. The substrate 42 has a bonding pad 46 Which is connected to the E1 electrode of the laser diode 40 on the top side of the substrate 42 and extended through a plated-through conduit 46F to the bottom side of the substrate serving as the ?rst extended input terminal. The substrate 42 also has bonding pad 48 connected to the E2 electrode of the laser diode 40 on the top side of the substrate 42 and extended through a plated-through hole 48F to the bottom side of the substrate serving as the second extended
25

substrate;
four Walls erected to enclose said laser diode; and
a transparent cover resting on said Walls.

7. A surface mount package as described in claim 6,
Wherein said cover is mounted With a lens.

8. A surface mount package as described in claim 7, Wherein said lens is a focusing lens. 9. A surface mount package as described in claim 7, Wherein said lens is a divergent lens. 10. Asurface mount package for laser diode having a ?rst electrode on the top surface of said diode and a second electrode at the bottom surface of said diode, comprising:
a substrate on Which said laser diode is mounted on the

input terminal. The bonding pad 48 is placed underneath the
laser diode 40. FIG. 4C shoWs the cross-sectional vieW of the structure

top of said substrate;
?rst plated-through conduit having a ?rst end connected to a ?rst bonding pad for bonding to said ?rst electrode,
and a second end connected to a ?rst circuit contact at

shoWn in FIG. 4B. The ?rst bonding pad 46 is extended through a plated-through conduit 46F to the other side of the
substrate 42 to form circuit contact 46B. The second bond

the bottom of said substrate;
a second plated-through conduit having one end con

ing pad 48 is fed through a plated-through hole 48F to the
other side of the substrate 42 to form a circuit contact 48 B.

nected to a second bonding pad for bonding to said
45

While the preferred embodiments of the invention have been shoWn are described, it Will be apparent to those skilled
in the art that various modi?cation may be made in the

second electrode, and a second end connected to a second circuit contact at the bottom surface of said

embodiments Without departing from the spirit of the present
invention. Such modi?cations are all Within the scope of this invention. What is claimed is: 1. A surface mount package for a semiconductor laser diode having a ?rst electrode on the top surface of said diode and a second electrode at the bottom surface of said diode,

substrate;
Wherein at least one of said ?rst conduit and said second conduit are semicircular grooves along the side of said substrate. 11. A surface mount package as described in claim 10, Wherein said ?rst conduit is a groove along the side of said substrate, and said second conduit is a via hole beneath said laser diode. 12. A surface mount package as described in claim 10,

comprising
a substrate on Which said laser diode is mounted on a top

surface of said substrate;
a ?rst plated-through conduit having a ?rst end connected

55

to a ?rst bonding pad for bonding to said ?rst electrode,
and a second end connected to a ?rst circuit contact at

the bottom surface of said substrate; and
a second plated-through conduit having one end con

Wherein said ?rst bonding pad is Wire-bonded to said ?rst electrode. 13. A surface mount package as described in claim 10, Wherein said second bonding pad is ?ip-chip bonded to said second electrode. 14. A surface mount package as described in claim 10,

nected to a second bonding pad for bonding to said
second electrode, and a second end connected to a second circuit contact at the bottom surface of said

Wherein said ?rst bonding pad and said second bonding pad
are plated ?at at the top surface of said substrate. 15. A surface mount package as described in claim 10, Wherein said second bonding pad has a large enough area to
65 serve as a heat sink.

substrate. 2. A surface mount package as described in claim 1, Wherein said ?rst bonding pad is Wire bonded to said ?rst electrode.

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 1 of 10 PageID #: 22

Exhibit B

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 2 of 10 PageID #: 23
US006300674B1

(12) United States Patent
Wang

(16) Patent N6.=
(45) Date of Patent:

US 6,300,674 B1
Oct. 9, 2001

(54)

FLAT PACKAGE FOR SEMICONDUCTOR DIODES

FOREIGN PATENT DOCUMENTS
59208756-A * 11/1984 (JP) .

(75)

Inventor:

Bily Wang; Hsin-Chu

2000349222A * 12/2000 (JP)'
* cited by examiner

(73) Assignee: Harvatek C0rp.; Hsin-Chu (TW)
(*) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35

Primary Examiner—Nathan Flynn
Assistant EX?min€r—R6InIn0n R. FOrdé (74) Attorney, Agent, or Firm—H. C. Lin, Patent Agent

U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/596,907
(22) (51) (52)
(58)

(57)

ABSTRACT

TWo ?at contact pads form a portion of the bottom surface
of a ?at package and constitute the tWo external connections for the diode. The diode rests on at least one the contact PadS- The diode and the Contact Pads are Covered With Preteetive glue If the diode has one eleetrede at the bottom

Filed: Jun‘ 19’ 2000 Int. Cl.7 ................................................. .. H01L 23/495 US. Cl. .......................... .. 257/666; 257/99; 257/433;

257/735; 438/124
Field Of Search ............................ .. 257/99, 100, 433, 257/676 735 774 773 779 782 783

surface; the contact pad not in contact With diode is Wire
hehded th the top eteettede It the ehede has both eteettedee at the bottom surface; the tWo electrodes can rest on tWo

’

’

’ 66,6 78;‘, 458/124;
’ ’

separate contact pads. If the diode has both electrodes on the
top surface; the electrodes can be Wire-bonded to the tWo

(56)

References Cited
US PATENT DOCUMENTS
5 444 301 * 8/1995 Song et al. ......................... .. 257/737

separate contact pads. The top surface of the contact pads
can be roughened or protruded to increase adhesion between

the protective glue and the contact pads. The contact pads
can also have tunnels at the bottom Surface to increase the

5:969:416 * 10/1999 Kim ................ ..

257/692

ghhhg thtertaee hetWeeh the Contact Pads ahd the glue
9 Claims, 6 Drawing Sheets

6,114,750 * 9/2000 Udagawa et al. . 257/666 6,130,115 * 10/2000 Okumura et al. .................. .. 438/124

24

26
2O

1

27

25
23

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 3 of 10 PageID #: 24

U.S. Patent

061. 9, 2001

Sheet 1 6f 6

US 6,300,674 B1

14
16

1O

7.
15
12 ——

17

13

Fig.1 Prior Art

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 4 of 10 PageID #: 25

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 5 of 10 PageID #: 26

U.S. Patent

061. 9, 2001

Sheet 3 6f 6

US 6,300,674 B1

27
I

A,

'

m

256 \/ 25
Fig.5

\ ¥23 236

7 27

$01.1
258 _i/ 25
Fig.6
23

238

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 6 of 10 PageID #: 27

U.S. Patent

061. 9, 2001

Sheet 4 6f 6

US 6,300,674 B1

37
30

I
35

33

304

302

42

44

q

402

I!

47
43

L

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 7 of 10 PageID #: 28

U.S. Patent

061. 9, 2001

Sheet 5 6f 6

US 6,300,674 B1

r—— 27

25

55

F“ 27

//~‘ 25
/

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 8 of 10 PageID #: 29

U.S. Patent

061. 9, 2001

Sheet 6 6f 6

US 6,300,674 B1

27

Fig.1 1

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 9 of 10 PageID #: 30

US 6,300,674 B1
1
FLAT PACKAGE FOR SEMICONDUCTOR DIODES
BACKGROUND OF THE INVENTION

2
a bottom electrode 22 and top electrode 24. The bottom electrode is directly mounted on top of the contact pad 23 and the top electrode of the diode 20 is Wire bonded to the

(1) Field of the Invention
This invention relates to semiconductor diode package, in

contact pad 25. After Wire bonding, the assembly is sealed in protective glue 27. For an optical device, the protective glue is transparent. The top vieW of the contact pads of the
package is shoWn in FIG. 3. The top surfaces of the contact pads 23 and 25 are roughened to increase the adhesion betWeen the protective glue 27 and the contact pads 23 and 25 so that the protective glue 27 does not peel off from the contact pads 23 and 25. The adhesion can further be enhanced by cutting a hole
and/or a slot in the contact pads as shoWn in FIG. 4. As shoWn, a hole 254 is cut in the contact pad 25 and a slot 234
15

particular to optical diodes. (2) Brief Description of the Related Art
FIG. 1 shoWs a conventional dual-inline package for semiconductor diodes such as that used for light emitting
10

diodes (LED), laser diodes (LD), photo-diodes (PD) etc.
Such packages are also applicable to image sensors. The diode chip 10 has a bottom electrode 12 and a top electrode 14. These electrodes are coupled to the extensions of tWo pins 13 and 15 for external connections. The bottom elec trode 12 is coupled to pin 13 and the top electrode 15 is

is cut in the contact pad 23. When protective glue is poured
into the hole 254 and the slot 234, the surface betWeen the protective glue 27 and the contact pads 23 and 25 is increased so that the protective glue 27 does not peel off from the contact pads 23 and 25.
FIG. 5 shoWs another embodiment of this invention. The contact pad 23 and 25 are stamped from the bottom to produce tWo tunnels 236 and 256 underneath the contact pads as shoWn in the bottom vieW FIG. 10 and the

coupled through a bonding Wire to pin 15. T
he trend today is to miniaturiZe the package siZe of a semiconductor device. The extensions of pins 13 and 15 occupy space of the package.
SUMMARY OF THE INVENTION

An object of this package is to miniaturiZe the dimensions of a diode package. Another object of this invention is to facilitate surface mounting the package. These objects are
obtained by surface mounting a diode package as a ?at

25

package. The bottom of the ?at package has tWo pads, Which
form the external connections for the diode. The bottom electrode is mounted on one of the pads and the top electrode of the diode is Wire bonded to the other pad. Thus no extensions of the connection pins are used and space is

saved. The package is sealed in a transparent protective glue
for an optical device.
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
35

3-dimensional vieW in FIG. 11. During the sealing process, the glue ?oWs into the tunnels 236 and 256 from the ends. These tunnels increase the gluing interface betWeen the glue 27 and the contact pads 23 and 25, so that the contact pads 23 and 25 do not peel off easily from the protective glue 27. The tunnels 236 and 256 can be formed by stamping from the bottom surfaces of the respective pads. The protrusions created by the stamping process also increase the gluing interface to hold the contact pads in place. FIG. 9 shoWs the bottom vieW of the contact pads after gluing. The dotted outline 55 shoWs the contact pads and the solid outline shoWs the over?oW pattern of the glue 27. The over?oW 55
55 on the pad 25 can then removed for better soldering function at the pad. FIG. 6 shoWs still another embodiment of this invention.
The contact pads are eroded or cut from the bottom to create

FIG. 1 shoWs the side vieW of a prior art duel inline package for a semiconductor diode. FIG. 2 shoWs the side vieW of the basic structure of the ?at

package of the present invention.
FIG. 3 shoWs the bottom vieW of the roughened surface of the contact pads. FIG. 4 shoWs the bottom vieW of the package With a hole
and a slot to increase adhesion.
45

tWo tunnels 238 and 285 in the contact pads 23 and 25 respectively. As in FIG. 5, these tunnels increase the adhe

sion betWeen the protective glue 27 and the contact pads 23,
25. These tunnels can be formed by means of mechanical

grinding, scribing or chemical etching, etc.
FIG. 7 shoWs a ?at package for mounting a diode 30 With
tWo bottom electrodes 302 and 304. These electrodes rest on

FIG. 5 shoWs a second embodiment of the present inven tion. FIG. 6 shoWs a third embodiment of the present invention. FIG. 7 shoWs a package for mounting a diode With tWo bottom electrodes. FIG. 8 shoWs a package for mounting a diode With tWo top electrodes. FIG. 9 shoWs the over?oW pattern of glue at the bottom

tWo contact pads 33 and 35 respectively at the bottom of the ?at package Without any bonding Wires. The diode 30 and the contact pads 33 and 35 are covered With protective glue 37. The bottoms of the contact pads 33 and 35 can be
coupled to a motherboard. FIG. 8 shoWs a ?at package for mounting a diode 40 With tWo top electrodes 42 and 44. These tWo electrodes 42 and 55 44 are Wire bonded to tWo contact pads 43 and 45 respec

of the package.
FIG. 10 shoWs a tunnel at the bottom of the package. FIG. 11 shoWs a three-dimensional vieW of the tunnel shoWn in FIG. 10.
DETAILED DESCRIPTION OF THE INVENTION

tively. The diode 40 is mounted on the contact pad 43. The structure is then sealed in protective glue 47. The bottoms of the contact pads 43 and 45 can be coupled to a motherboard. While the preferred embodiments of the invention have been described, it Will be apparent to those skilled in the art that various modi?cations may be made in the embodiments

Without departing from the spirit of the present invention.
Such modi?cations are all Within the scope of this invention. What is claimed is:
65

FIG. 2 shoWs the side vieW of the basic package of the present invention. The bottom of the package has tWo ?at contact pads 23 and 25, Which can be used for surface
mounting on a motherboard. A semiconductor diode 20 has

1. A ?at package, comprising;
a semiconductor diode having a top surface and a bottom

surface and tWo electrodes;

Case 6:13-cv-00901 Document 1-2 Filed 11/22/13 Page 10 of 10 PageID #: 31

US 6,300,674 B1
3
tWo contact pads for making external electrical connec tions With bottom surfaces planar With the bottom of said package, and having said diode mounted on at least one of said tWo contact pads; and a protective glue to cover said diode and said contact

4
5. A ?at package as described in claim 1, Wherein the contact pads have protrusions at the upper surface of said contact pads to increase adhesion betWeen said protective

glue and said contact pads.
6. A ?at package as described in claim 1, Wherein said contact pads have depressions in the bottom surface of said contact pads to increase gluing interface betWeen contact pads and said glue and to hold said contact pads in place. 7. A?at package as described in claim 1, Wherein the tWo
said electrodes of the diode are located at the bottom surface of said diode and make direct contact With tWo respective

pads.
2. A?at package as described in claim 1, Wherein the ?rst electrode of said tWo electrodes is located at the bottom surface of said diode and mounted on ?rst contact pad of said tWo contact pads, and the second electrode of said tWo electrodes is located at the top surface of said diode and Wire-bonded to the second contact pad of said tWo contact

contact pads Without Wire-bonding.
8. A?at package as described in claim 1, Wherein the tWo said electrodes of the diode are located at the top surface of said diode and Wire-bonded to said tWo contact pads. 9. A ?at package as described in claim 1, Wherein said

pads.
33. A ?at package as described in claim 1, Wherein the top surfaces of said contact pads are roughened to increase
15

adhesion betWeen said protective glue and said contact pads.
4. A ?at package as described in claim 1, Wherein said contact pads have holes for said protective glue to adhere.

protective glue is transparent.
* * * * *

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 1 of 12 PageID #: 32

Exhibit C

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 2 of 12 PageID #: 33
US006841934B2

(12) United States Patent
Wang et al.

(16) Patent N63
(45) Date of Patent:

US 6,841,934 B2
Jan. 11, 2005

(54) WHITE LIGHT SOURCE FROM LIGHT
EMITTING DIODE

(56)
_

References Cited
U.S. PATENT DOCUMENTS

(75) Inventors: Blly Wang, Hsin-Chu (TW); Jonme
Chuang, Taipei Yann Lee,

_

_

6,299,498 B1 * 10/2001 Liu et al. .................... .. 445/24

Hsinchu

* cited by examiner

(73) Assignee: Harvatek Corporation, Hsin-Chu

(TW)
(*) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35

Primary Examiner—Vip Patel
(74) Attorney) A gem, 0r Firm_Rosenberg, Klein & Lee

U.S.C. 154(b) by 80 days.
(21) Appl' N05 10/372,848 (22) Filed: Feb 26’ 2003
(65) Prior Publication Data
/ ug ’ Int. Cl.7 ................................................. .. H01J 1/62 us. Cl. ...................... .. 313/512; 313/501; 313/506
Field of Search ............................... .. 313/498, 501,
US 2004 0164675 A1 A . 26 2004

(57)

ABSTRACT

A White light source is obtained by converting short Wave

length color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip With
a ?uorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as terminals for the LED. A Wall may be erected around the . . LED chip to contain the ?uorescent glue, and another transparent glue may be used to cover the ?uorescent glue for protection

(51) (52)
(58)

313/506, 508, 509, 512

9 Claims, 8 Drawing Sheets

261

26

1

1
. n

1
1

4

14

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 3 of 12 PageID #: 34

U.S. Patent

Jan. 11,2005

Sheet 1 of 8

US 6,841,934 B2

Fig. 1. Prior Art

12

. . r

16

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 4 of 12 PageID #: 35

U.S. Patent

Jan. 11,2005

Sheet 2 of 8

US 6,841,934 B2

Fig. 2. Prior A11

16

12

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 5 of 12 PageID #: 36

U.S. Patent

Jan. 11,2005

Sheet 3 of 8

US 6,841,934 B2

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 6 of 12 PageID #: 37

U.S. Patent

Jan. 11,2005

Sheet 4 of 8

US 6,841,934 B2

25

A

251

252

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 7 of 12 PageID #: 38

U.S. Patent

Jan. 11,2005

Sheet 5 of 8

US 6,841,934 B2

25

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 8 of 12 PageID #: 39

U.S. Patent

Jan. 11,2005

Sheet 6 of 8

US 6,841,934 B2

26

25

10

13

16

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 9 of 12 PageID #: 40

U.S. Patent

Jan. 11,2005

Sheet 7 of 8

US 6,841,934 B2

261

26

/
ll

‘ T

‘

\
12

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 10 of 12 PageID #: 41

U.S. Patent

Jan. 11,2005

Sheet 8 of 8

US 6,841,934 B2

261

26

101

WW
5 . . . . . . . . . . . . . . ..1..

12

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 11 of 12 PageID #: 42

US 6,841,934 B2
1
WHITE LIGHT SOURCE FROM LIGHT EMITTING DIODE
BACKGROUND OF THE INVENTION

2
With a ?uorescent glue 16. The ?uorescent glue coverts the color light emitted from the LED 10 into White light. The metal section sections 11 and 12 have through holes 14 for

the ?uorescent glue to ?oW through during sealing, thus
strengthening the structure. The extensions of sections 11
and 12 are not covered by the ?uorescent glue 16 to serve as

(1) Field of the Invention This invention is related to a light emitting diode (LED), particularly to a LED package for emitting White light. (2) Brief Description of Related Art
FIG. 1 shoWs a prior art LED package. An LED chip 10
is mounted on the left side of a substrate. The substrate is split in the middle With a gap into a left hand section 11 and

terminals of the LED for surface mounting. FIG. 4 shoWs a Wall 25 for surrounding the LED chip
shoWn in FIG. 3. The Wall 25 can be of equal height as or

unequal height as the ?uorescent glue 16. Wall 25 is of equal height. Wall 251 is of taller height. Wall 252 is of shorter

height.
15

a right hand section 12. The bottom electrode of the LED chip 10 is mounted on the left hand section 11, and the top electrode of the LED chip 10 is Wire bonded by Wire 13 to the right hand section 12. The extensions of sections 11 and 12 serve as terminals for surface mounting of the LED

FIG. 5 shoWs the Wall 25 erected outside the ?uorescent glue 16 shoWn in FIG. 3. In this ?gure, the Wall is taller than the ?uorescent glue 16. FIG. 6 shoWs a Wall 25 taller than the ?uorescent glue 16
to provide space for a transparent glue 26 to ?ll over the

package. The substrate and the chip 10 are encapsulated in a sealing glue 16 as shoWn in the side vieW FIG. 2. Athrough
hole 15 and a cut 14 are inserted in the substrate for the glue to ?ll for stronger adhesion. Since an LED normally can

?uorescent glue 16 for protection of the ?uorescent glue 16.
FIG. 7 shoWs another embodiment Where the transparent glue also covers the outside surface of the Wall to strengthen
the structure as a layer 261.

emit only color light, the light emitted from the package
cannot emit White light.
25

SUMMARY OF THE INVENTION
An object of this invention is to use an LED to generate

White light. Another object of this invention is to reduce the height of an LED package. Still another object of this invention is to protect the LED from contamination.

FIG. 8 shoWs a package for a ?ip-chip LED 101. The LED chip 101 has tWo bottom electrodes, in contact With said ?rst metal section 11 and said second metal section 12, respec tively. Other parts of the package are the same as that shoWn in FIG. 7. The LEDs described in FIGS. 3—7 are short Wavelength LEDs selected from the group, consisting of blue light

LEDs, purple light LEDs, blue-purple light LEDs, and
ultra-violet light LEDs While the preferred embodiment of the invention have
35

These objects are obtained by using a short Wavelength light emitting diode. A thin layer of ?uorescent glue covers the top and peripheral of the light emitting diode. The LED normally emits short Wavelength color light, such as blue, purple, blue-purple or UV color light, other than White light. The ?uorescent glue converts the short Wavelength color light into White light. The ?uorescent glue also seals the

package against contamination and strengthens the package

been described, it Will be apparent to those skilled in the art that various modi?cations can be in the embodiments With out departing from the spirit of the resent invention. Such modi?cations are all Within the scope of the present inven tion. What is claimed is:

structurally.
BRIEF DESCRIPTION OF THE DRAWGINGS

40

1. A light emitting diode (LED) White light source,

comprising:
a light emitting diode chip having a bottom electrode and a second electrode, and emitting short Wavelength color

FIG. 1 shoWs the top vieW of a prior art LED package. FIG. 2 shoWs the side vieW of a prior art LED package. FIG. 3 shoWs the basic structure of the LED package of the present invention. FIG. 4 shoWs a Wall for the LED package. FIG. 5 shoWs the Wall shoWn in FIG. 4 surrounding the

light;
a split metal substrate having a ?rst metal section and a

second metal section, separate from each other,
Wherein said ?rst metal section is mounted With said bottom electrode and said second section is connected to said second electrode;

LED chip.
FIG. 6 shoWs a transparent glue covering the ?uorescent

a ?uorescent glue, covering said LED chip and inner ends
of said ?rst section and said second section, and con

glue.
FIG. 7 shoWs the transparent glue covering the side and top of the LED package.
FIG. 8 shoWs a package for ?ip-chip LED.
DETAILED DESCRIPTION OF THE INVENTION
55

verting said short Wavelength color light into White light, and
terminals for said LED formed by the outer ends of said ?rst metal section and said second metal section, not

covered by said ?uorescent glue.
2. The LED White light source as described in claim 1, further comprising at least one through holes in said ?rst metal section and said second metal section for said ?uo rescent glue to ?ll and to strengthen the adhesion betWeen

FIGS. 3—7 shoW the construction of the LED package as
a White light source.

the ?uorescent glue and said substrate.
3. The LED White light source as described in claim

FIG. 3 shoWs the side vieW of the basic structure of the

present invention. A short Wavelength color LED 10 is
mounted on the left section 11 of a metal substrate, Which is

1,further comprising a Wall erected around said ?uorescent

glue to contain said ?uorescent glue.
65

split With a right hand section 12. The top electrode of the LED 10 is Wire bonded by Wire 13 to the right section 12. The LED chip 10 and the metal sections 11 and 12 are sealed

4. The LED White light source as described in claim 3, Wherein said Wherein said Wall is of unequal height as said

?uorescent glue.

Case 6:13-cv-00901 Document 1-3 Filed 11/22/13 Page 12 of 12 PageID #: 43

US 6,841,934 B2
3
5. The LED White light source as described in claim 4,

4
8. The LED White light source as described in claim 1, Wherein said second electrode is a top electrode Wire bonded to said second metal section. 9. The LED White light source as described in claim 1, Wherein said second electrode is a second bottom electrode in contact With said second metal section.

further comprising a transparent glue covering said ?uores cent glue to protect said ?uorescent glue.
6. The LED White light source as described in claim 5, Wherein the transparent glue also covers the outside of said Wall. 7. The LED White light source as described in claim 1, Wherein said LED is selected from the group consisting of

short Wavelength blue light, purple light, blue-purple light,
and ultraviolet light.

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 1 of 7 PageID #: 44

Exhibit D

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 2 of 7 PageID #: 45
USO0D659655S

(12) United States Design Patent (10) Patent No.: Wang (45) Date of Patent:
(54) LED PACKAGE BASE
D599,305 S
D633,053 S

US D659,655 S
*9: May 15, 2012
Kimet a1. .................. .. Dl3/l80
Lin ........... .. .. Dl3/l80

*
*

9/2009
2/20ll

(75) Inventor: Bily Wang, Hsinchu (TW)

7,910,948 B2*
D637,98l S
7,935,982

3/20ll Kim et a1.
5/20ll
5/20ll

257/99
.. Dl3/l80
...... . . . .. 257/99

*

K0 etal.
Kim et a1.

(73) Assignee: Harvatek Corporation, Hsinchu (TW)
(**) Term: 14 Years

B2*

7,968,900 B2*

6/20ll

Hussellet a1. ................ .. 257/99

* cited by examiner
Primary Examiner * Selina Sikder

(21) Appl.No.: 29/396,123
(22) Filed: Jun. 26, 2011

(74) Attorney, Agent, or Firm * Li & Cai Intellectual

Property (USA) Of?ce
(57) CLAIM
The ornamental design for a “LED package base,” as shoWn and described.
DESCRIPTION

(30)
(51)
(52)

Foreign Application Priority Data
Jan. 5, 2011 (TW) ............................... .. 100300049

LOC (9) Cl.
US. Cl. .................................... ..

.... .. 13-03
.. D13/180

(58)

Field of Classi?cation Search ............... .. Dl3/l80;

D26/l, 2; 257/79, 80, 81, 88, 89, 95, 98, 257/99, 100, E33.058; 313/483, 498, 500;
362/555, 800 See application ?le for complete search history.
(56) References Cited
U.S. PATENT DOCUMENTS
D534,l32 S * 12/2006 Yoon .......................... .. Dl3/l80

FIG. 1 is a perspective vieW of a “LED package base” shoW

ing my neW design;
FIG. 2 is a front vieW thereof;
FIG. 3 is a rear vieW thereof;

FIG. FIG. FIG. FIG.

4 5 6 7

is is is is

a left side vieW thereof; a right side vieW thereof; a top vieW thereof; a bottom vieW thereof; and,

FIG. 8 is a perspective vieW showing the practical usage.

7,242,035 B2 * D558,693 S *

7/2007 l/2008

Kim et a1. ...... .. 257/99 Shin et a1. .................. .. Dl3/l80

1 Claim, 5 Drawing Sheets

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 3 of 7 PageID #: 46

US. Patent

May 15, 2012

Sheet 1 of5

US D659,655 S

w....

w

¢

w

w
w ...

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 4 of 7 PageID #: 47

US. Patent

May 15, 2012

Sheet 2 of5

US D659,655 S

z.

"

v

‘

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 5 of 7 PageID #: 48

US. Patent

May 15, 2012

Sheet 3 of5

US D659,655 S

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 6 of 7 PageID #: 49

US. Patent

May 15, 2012

Sheet 4 of5

US D659,655 S

Case 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 7 of 7 PageID #: 50

US. Patent

May 15,2012

Sheet 5 of5

US D659,655 S

JS 44 (Rev. )

Case 6:13-cv-00901 Document 1-5 Filed 11/22/13 Page 1 of 1 PageID #: 51

CIVIL COVER SHEET

The JS 44 civil cover sheet and the information contained herein neither replace nor supplement the filing and service of pleadings or other papers as required by law, except as provided by local rules of court. This form, approved by the Judicial Conference of the United States in September 1974, is required for the use of the Clerk of Court for the purpose of initiating the civil docket sheet. (SEE INSTRUCTIONS ON NEXT PAGE OF THIS FORM.)

I. (a) PLAINTIFFS
HARVATEK CORPORATION

DEFENDANTS
Nichia Corporation
County of Residence of First Listed Defendant
NOTE: (IN U.S. PLAINTIFF CASES ONLY) IN LAND CONDEMNATION CASES, USE THE LOCATION OF THE TRACT OF LAND INVOLVED.

(b) County of Residence of First Listed Plaintiff
(EXCEPT IN U.S. PLAINTIFF CASES)

Ni, Wang, & Associates, PLLC 8140 Walnut Hill Lane, Ste. 310, Dallas, TX 75231 Tel: 972-331-4600

(c) Attorneys (Firm Name, Address, and Telephone Number)

Attorneys (If Known)

II. BASIS OF JURISDICTION
u 1 U.S. Government Plaintiff

(Place an “X” in One Box Only)

III. CITIZENSHIP OF PRINCIPAL PARTIES (Place an “X” in One Box for Plaintiff)
(For Diversity Cases Only) PTF Citizen of This State u 1 Citizen of Another State u 2 u 3 DEF u 1 u u 2 and One Box for Defendant) PTF DEF Incorporated or Principal Place u 4 u 4 of Business In This State Incorporated and Principal Place of Business In Another State Foreign Nation u u 5 u 5 u 6

u 3 Federal Question (U.S. Government Not a Party) u 4 Diversity (Indicate Citizenship of Parties in Item III)

u 2

U.S. Government Defendant

Citizen or Subject of a Foreign Country

3

6

IV. NATURE OF SUIT
CONTRACT u u u u u u u u u u u u 110 Insurance 120 Marine 130 Miller Act 140 Negotiable Instrument 150 Recovery of Overpayment & Enforcement of Judgment 151 Medicare Act 152 Recovery of Defaulted Student Loans (Excl. Veterans) 153 Recovery of Overpayment of Veteran’s Benefits 160 Stockholders’ Suits 190 Other Contract 195 Contract Product Liability 196 Franchise REAL PROPERTY 210 Land Condemnation 220 Foreclosure 230 Rent Lease & Ejectment 240 Torts to Land 245 Tort Product Liability 290 All Other Real Property

(Place an “X” in One Box Only) TORTS u u u u u u u u u u u u u u u u u PERSONAL INJURY 310 Airplane 315 Airplane Product Liability 320 Assault, Libel & Slander 330 Federal Employers’ Liability 340 Marine 345 Marine Product Liability 350 Motor Vehicle 355 Motor Vehicle Product Liability 360 Other Personal Injury 362 Personal Injury Med. Malpractice CIVIL RIGHTS 440 Other Civil Rights 441 Voting 442 Employment 443 Housing/ Accommodations 445 Amer. w/Disabilities Employment 446 Amer. w/Disabilities Other 448 Education PERSONAL INJURY u 365 Personal Injury Product Liability u 367 Health Care/ Pharmaceutical Personal Injury Product Liability u 368 Asbestos Personal Injury Product Liability PERSONAL PROPERTY u 370 Other Fraud u 371 Truth in Lending u 380 Other Personal Property Damage u 385 Property Damage Product Liability PRISONER PETITIONS u 510 Motions to Vacate Sentence Habeas Corpus: u 530 General u 535 Death Penalty u 540 Mandamus & Other u 550 Civil Rights u 555 Prison Condition u 560 Civil Detainee Conditions of Confinement

FORFEITURE/PENALTY u 625 Drug Related Seizure of Property 21 USC 881 u 690 Other

BANKRUPTCY u 422 Appeal 28 USC 158 u 423 Withdrawal 28 USC 157 PROPERTY RIGHTS u 820 Copyrights u 830 Patent u 840 Trademark u u u u u u u u u u u u u u u u u

OTHER STATUTES 375 False Claims Act 400 State Reapportionment 410 Antitrust 430 Banks and Banking 450 Commerce 460 Deportation 470 Racketeer Influenced and Corrupt Organizations 480 Consumer Credit 490 Cable/Sat TV 850 Securities/Commodities/ Exchange 890 Other Statutory Actions 891 Agricultural Acts 893 Environmental Matters 895 Freedom of Information Act 896 Arbitration 899 Administrative Procedure Act/Review or Appeal of Agency Decision 950 Constitutionality of State Statutes

u u u u u u

LABOR 710 Fair Labor Standards Act 720 Labor/Mgmt. Relations 740 Railway Labor Act 751 Family and Medical Leave Act 790 Other Labor Litigation 791 Empl. Ret. Inc. Security Act

u u u u u

SOCIAL SECURITY 861 HIA (1395ff) 862 Black Lung (923) 863 DIWC/DIWW (405(g)) 864 SSID Title XVI 865 RSI (405(g))

u u u u u u

FEDERAL TAX SUITS u 870 Taxes (U.S. Plaintiff or Defendant) u 871 IRS—Third Party 26 USC 7609

IMMIGRATION u 462 Naturalization Application u 463 Habeas Corpus Alien Detainee (Prisoner Petition) u 465 Other Immigration Actions

V. ORIGIN

u 1 Original Proceeding

Transferred from u 2 Removed from u 3 Remanded from u 4 Reinstated or u 5 another district u 6 Multidistrict State Court Appellate Court Reopened Litigation (specify) Cite the U.S. Civil Statute under which you are filing (Do not cite jurisdictional statutes unless diversity):

(Place an “X” in One Box Only)

VI. CAUSE OF ACTION Brief description of cause:
Patent Infringement

Title 35 of United States Code

DEMAND $ u CHECK IF THIS IS A CLASS ACTION VII. REQUESTED IN UNDER F.R.C.P. 23 Monetary COMPLAINT: VIII. RELATED CASE(S) (See instructions): JUDGE IF ANY
DATE SIGNATURE OF ATTORNEY OF RECORD

CHECK YES only if demanded in complaint: u Yes u No JURY DEMAND: DOCKET NUMBER

11/22/2013
FOR OFFICE USE ONLY RECEIPT # AMOUNT

/s/ Hao Ni

APPLYING IFP

JUDGE

MAG. JUDGE