X7R Floating Electrode.pdf
Content
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design (FE-CAP), X7R Dielectric 6.3VDC-250VDC (Commercial & Automotive Grade)
Overview
KEMET’s Floating Electrode (FE-CAP) multilayer ceramic capacitor in X7R dielectric utilizes a cascading internal electrode design configured to form multiple capacitors in series within a single monolithic structure. This unique configuration results in enhanced voltage and ESD performance over standard capacitor designs while allowing for a fail-open condition if mechanically damaged (cracked). If damaged, the device may experience a drop in capacitance but a short is unlikely. The FE-CAP is designed to reduce the likelihood of a low IR or short circuit condition and the chance for a catastrophic and potentially costly failure event. Driven by the demand for a more robust and reliable component, the FE-CAP was designed for critical applications where higher operating temperatures and mechanical stress are a concern. These components are RoHS compliant, meet the requirements of the Automotive Electronics Council's AEC-Q200 and are widely used in automotive circuits as well as power supplies (input and output filters) and general electronic applications. Combined with the stability of an X7R dielectric, the FE-CAP complements KEMET’s “Open Mode” devices by providing a failsafe design optimized for low to mid range capacitance values. These devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C.
Benefits
• • • • • • • • • •
-55°C to +125°C operating temperature range Floating Electrode/fail open design Low to mid capacitance flex mitigation Pb-Free and RoHS compliant (excluding SnPb end metallization option) EIA 0402, 0603, 0805, 1206, 1210, & 1812 case sizes DC voltage ratings of 6.3V, 10V, 16V, 25V, 50V, 100V, 200V, & 250V Capacitance offerings ranging from 150pF to 0.22μF Available capacitance tolerances of ±5%, ±10% and ±20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated end metallization allowing for
excellent solderability • SnPb end metallization option available upon request (5% min) • Commercial and Automotive (AEC-Q200) grades available
Ordering Information
C
Ceramic
0805
Case Size (L" x W") 0402 0603 0805 1206 1210 1812
S
Specification/ Series S = Floating Electrode
104
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = ±5% K = ±10% M = ±20%
5
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 6 = 35V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
C
TU
Packaging/Grade (C-Spec)2
Failure Rate/ End Metallization 1 Design A = N/A
C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
1 2
Additional termination options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details.
One WORLD
One Brand
One Strategy
One Focus
One Team
One KEMET
C1014-1 • 10/12/2010 1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
T
W
L B
100% Tin or SnPb Plate
S
Nickel Plate Electrodes Conductive Metalization
EIA Size Code
0402 0603 0805 1206 1210 1812
Metric Size Code
1005 1608 2012 3216 3225 4532
L Length
1.00 (.040) ± 0.05 (.002) 1.60 (.063) ± 0.15 (.006) 2.00 (.079) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 4.50 (.177) ± 0.30 (.012)
W Width
0.50 (.020) ± 0.05 (.002) 0.80 (.032) ± 0.15 (.006) 1.25 (.049) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 3.20 (.126) ± 0.30 (.012)
B Bandwidth
0.30 (.012) ± 0.10 (.004) 0.35 (.014) ± 0.15 (.006) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.60 (.024) ± 0.35 (.014)
T Thickness
Mounting Technique
Solder Reflow Only Solder Wave or Solder Reflow Solder Reflow Only
See Table 2 for Thickness
Applications
Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website @www.aecouncil.com.
Environmental Compliance
Devices with “C” end metallization option are RoHS PRC ( Peoples Republic of China) compliant. Devices with “L” end metallization option do no meet RoHS criteria.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
2
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Operating Temperature Range: Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25ºC: Insulation Resistance (IR) Limit @ 25°C: -55°C to +125°C ±15% 3.5% 250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding 50mA) 5%(10V), 3.5%(16V & 25V) and 2.5%(50V to 200V) See Insulation Resistance Limit Table
Parameters/Characteristics
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
Insulation Resistance Limit Table
EIA Case Size
0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
1000 megohm microfarads or 100GΩ
N/A < .012µF < .047µF < .047µF < 0.22µF < 0.39µF ALL < 2.2µF ALL < 10µF ALL
500 megohm microfarads or 10GΩ
ALL ≥ .012µF ≥ .047µF ≥ .047µF ≥ 0.22µF ≥ 0.39µF N/A ≥ 2.2µF N/A ≥ 10µF N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
3
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 1A – (0402 - 0805 Case Sizes)
Cap
150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF
Cap Code
151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104
Series
Voltage Code Voltage DC Cap Tolerance J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Voltage DC Voltage Code M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M BB BB BB BB BB BB BB BB BB BB BB 9 6.3 8
C0402S
4 16 3 25 5 50 9 6.3 8 10 4 10
C0603S
3 25 5 50 1 100 2 200 9 6.3 8 10 4 16 16
C0805S
3 25 5 50 1 100 2 200 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC 200 2 A 250 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC 250 A
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 6.3 9 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 10 8 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 16 4 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 25 3 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 50 5 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD
200
100
Cap
Cap Code
9
8
4
3
5
9
8
4
3
5
1
2
Series
C0402S
C0603S
C0805S
C
Ceramic
0805
Case Size (L" x W") 0402 0603 0805 1206 1210 1812
S
Specification/ Series S = Floating Electrode
104
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = ±5% K = ±10% M = ±20%
5
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 6 = 35V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
C
TU
Packaging/Grade (C-Spec)2
Failure Rate/ End Metallization 1 Design A = N/A
C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
100 1
6.3
6.3
50
50
25
25
10
10
16
16
4
Roll Over for Order Info.
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 1B – (1206 - 1812 Case Sizes)
Cap
1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF
Cap Code
102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J
Series
Voltage Code Voltage DC Cap Tolerance K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Voltage DC Voltage Code M M M M M M M M M M M M M M M M M M M M M M M M M M M M M EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 9 6.3 8 10 4 16
C1206S
3 25 5 50 1 100 2 200 A 250 9 6.3 8 10 4 16
C1210S
3 25 5 50 1 100 2 200 A 250 9 6.3 8
C1812S
4 16 3 25 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 25 3 5 50 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 50 5 10 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 10 8
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 6.3 9
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 10 8
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 16 4
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 25 3
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 50 5
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FD
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC
GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 6.3 9
GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 16 4
200
200 2
250
Cap
Cap Code
9
8
4
3
5
1
2
A
1
Series
C1206S
C1210S
250 A
100
100
6.3
50
25
10
16
C1812S
C
Ceramic
0805
Case Size (L" x W") 0402 0603 0805 1206 1210 1812
S
Specification/ Series S = Floating Electrode
104
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = ±5% K = ±10% M = ±20%
5
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 6 = 35V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
C
TU
Packaging/Grade (C-Spec)2
Failure Rate/ End Metallization 1 Design A = N/A
C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
5
Roll Over for Order Info.
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness / Packaging Quantities
Thickness Code
AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF
Chip Size
01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225
Thickness ± Range (mm)
0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.05 0.80 ± 0.07 0.80 ± 0.10 0.80 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.25 ± 0.20 0.78 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.25 ± 0.15 1.60 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.50 ± 0.20 1.55 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 1.85 ± 0.20 1.85 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 2.25 ± 0.20 2.50 ± 0.20 0.80 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.30 ± 0.10 1.40 ± 0.15 1.50 ± 0.10 1.55 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.10 ± 0.15 1.15 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.70 ± 0.15 1.80 ± 0.15 2.40 ± 0.15 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.60 ± 0.20
Qty per Reel 7" Plastic
Qty per Reel 13" Plastic
Qty per Reel 7" Paper
15000 15000 10000 4000 4000 4000 4000 4000
Qty per Reel 13" Paper
50000 10000 10000 10000 10000 10000
Qty per Bulk Cassette
50000 15000
4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000
10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000
4000
10000
Package Quantity Based on Finished Chip Thickness Specifications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
6
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: • KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
EIA Size Code
01005 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
Metric Size Code
0402 0603 1005 1608 2012 3216 3225 4520 4532 4564 5650 5664
Density Level A: Maximum (Most) Land Protrusion (mm)
C 0.33 0.38 0.50 0.90 1.00 1.60 1.60 2.30 2.15 2.15 2.75 2.70 Y 0.46 0.56 0.72 1.15 1.35 1.35 1.35 1.75 1.60 1.60 1.70 1.70 X 0.43 0.52 0.72 1.10 1.55 1.90 2.80 2.30 3.60 6.90 5.50 6.90 V1 1.60 1.80 2.20 4.00 4.40 5.60 5.65 7.40 6.90 6.90 8.20 8.10 V2 0.90 1.00 1.20 2.10 2.60 2.90 3.80 3.30 4.60 7.90 6.50 7.90 C 0.28 0.33 0.45 0.80 0.90 1.50 1.50 2.20 2.05 2.05 2.65 2.60
Density Level B: Median (Nominal) Land Protrusion (mm)
Y 0.36 0.46 0.62 0.95 1.15 1.15 1.15 1.55 1.40 1.40 1.50 1.50 X 0.33 0.42 0.62 1.00 1.45 1.80 2.70 2.20 3.50 6.80 5.40 6.80 V1 1.30 1.50 1.90 3.10 3.50 4.70 4.70 6.50 6.00 6.00 7.30 7.20 V2 0.70 0.80 1.00 1.50 2.00 2.30 3.20 2.70 4.00 7.30 5.90 7.30 C 0.23 0.28 0.40 0.60 0.75 1.40 1.40 2.10 1.95 1.95 2.55 2.50
Density Level C: Minimum (Least) Land Protrusion (mm)
Y 0.26 0.36 0.52 0.75 0.95 0.95 0.95 1.35 1.20 1.20 1.30 1.30 X 0.23 0.32 0.52 0.90 1.35 1.70 2.60 2.10 3.40 6.70 5.30 6.70 V1 1.00 1.20 1.60 2.40 2.80 4.00 4.00 5.80 5.30 5.30 6.60 6.50 V2 0.50 0.60 0.80 1.20 1.70 2.00 2.90 2.40 3.70 7.00 5.60 7.00
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
7
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Ripple Current Terminal Strength Board Flex
Reference
Heat Generation ∆T : 20ºC max. JIS-C-6429 JIS-C-6429
Test or Inspection Method
Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve. (Ripple voltage must be < rated voltage) Appendix 1, Note: Force of 1.8kg for 60 seconds. Appendix 2, Note: 2mm (min) for all except 3mm for C0G. Magnification 50X. Conditions:
Solderability
J-STD-002
a) Method B, 4 hrs @ 155°C, dry heat @ 235°C b) Method B @ 215°C category 3 c) Method D, category 3 @ 260°C
Temperature Cycling Biased Humidity Moisture Resistance Thermal Shock High Temperature Life Storage Life Mechanical Shock Resistance to Solvents
JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 MIL-STD-202 Method 108 MIL-STD-202 Method 213 MIL-STD-202 Method 215
1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity: 1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. -55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes. Air-Air. 1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied. 150°C, 0VDC, for 1000 Hours. Figure 1 of Method 213, Condition F. Add aqueous wash chemical - OKEM Clean or equivalent.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
8
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
KE
ME
T
®
Embossed Plastic* or Punched Paper Carrier.
Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
Sprocket Holes
Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape
178mm (7.00") or 330mm (13.00")
Anti-Static Cover Tape (.10mm (.004") Max Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration (mm)
EIA Case Size
01005 - 0402 0603 - 1210 1805 - 1808 ≥ 1812 KPS 1210 KPS 1812 & 2220 Array 0508 & 0612
Tape size (W)*
8 8 12 12 12 16 8
Pitch (P1)*
2 4 4 8 8 12 4
*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1014-1 • 10/12/2010 9
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T T2 P2 ØDo Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
Ao F Ko B1 Bo E2 W
S1 T1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity
P1 ØD 1
Embossment For cavity size, see Note 1 Table 5
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) D0 D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 0.600 (0.024) T Max. T1 Max.
1.75 ± 0.10 (0.069 ± 0.004)
4.0 ± 0.10 (0.157 ± 0.004)
2.0 ± 0.05 (0.079 ± 0.002)
0.600 (0.024)
0.100 (0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm Pitch Single (4mm) Single (4mm) & Double (8mm) Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F 3.5 ± 0.05 (0.138 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) P1 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) T2 Max 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Max 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
10
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T ØDo P2 Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
A0
F E2 W
Bottom Cover Tape
B0
T1
P1
Top Cover Tape
T1
Center Lines of Cavity
Cavity Size, See Note 1, Table 7 Bottom Cover Tape
G
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm D0 1.5 +0.10-0.0 (0.059 +0.004, -0.0) E1 1.75 ±0.10 (0.069 ±0.004) P0 4.0 ±0.10 (0.157 ±0.004) P2 2.0 ±0.05 (0.079 ±0.002) T1Max 0.10 (.004) Max. G Min 0.75 (.030) R Ref. Note 2 25 (.984)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 8mm Pitch Half (2mm) Single (4mm) E2 Min 6.25 (0.246) F 3.5 ± 0.05 (0.138 ± 0.002) 2.0 ± 0.05 (0.079 ± 0.002) 4.0 ± 0.10 (0.157 ± 0.004) P1 T Max 1.1 (0.098) W Max 8.3 (0.327) 8.3 (0.327) A0 B 0 Note 5
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
11
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
Tape Width
8mm 12mm & 16mm
1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Peel Strength
0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum Component Rotation
° T
Maximum Component Rotation Top View
Typical Pocket Centerline
Maximum Component Rotation Side View
° s
Bo
Tape Width (mm) 8,12 16-200
Maximum Rotation ( 20 10
° T)
Typical Component Centerline
Ao
Tape Width (mm) 8,12 16-56 72-200
Maximum Rotation ( 20 10 5
° S)
Figure 4 – Maximum Lateral Movement
8mm & 12mm Tape
0.5 mm maximum 0.5 mm maximum
16mm Tape
1.0 mm maximum 1.0 mm maximum
Figure 5 – Bending Radius
Embossed Carrier Punched Carrier
R
Bending Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
12
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius, See Note Access Hole at Slot Location (Ø 40 mm min.)
W3 (Includes
flange distortion at outer edge)
W2 (Measured at hub) A D
(See Note)
C
(Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth
N W1 (Measured at hub)
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm A 178 ± 0.20 (7.008 ± 0.008) or 330 ± 0.20 (13.000 ± 0.008) B Min 1.5 (0.059) C 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) D Min 20.2 (0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm 50 (1.969) N Min 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) W1 W2 Max 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) W3 Shall accommodate tape width without interference
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
13
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier Punched Carrier 8 mm & 12 mm only Carrier Tape Round Sprocket Holes
END
START
Top Cover Tape
Elongated Sprocket Holes (32 mm tape and wider)
Trailer 160 mm minimum,
Top Cover Tape
Components
100 mm Min. Leader 400 mm Minimum,
Figure 8 – Maximum Camber
Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
14
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
6 8 ± 0.1 8 8 ± 0.1 12.0 ± 0.1
1.5 ± 2.0 ± 3.0 ±
0.1 0 0 0.1 0.2 0
53 3* 31.5 ± 0.2 0 36 ± 0 0.2 19.0*
10*
110 ± 0.7
5 0*
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters EIA Size Metric Size L Length Code Code
0402 0603 1005 1608 1.0 ± 0.05 1.6 ± 0.07
W Width
0.5 ± 0.05 0.8 ± 0.07
B Bandwidth
0.2 to 0.4 0.2 to 0.5
S Separation minimum
0.3 0.7
T Thickness
0.5 ± .05 0.8 ± .07
Number of Pcs/Cassette
50,000 15,000
Table 10 – Capacitor Marking
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)
Numeral Alpha Character
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y
Capacitance (pF) For Various Numeral Identifiers
9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000
Example shown is 1,000 pF capacitor
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
15
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Other KEMET Resources
Tools
Resource Configure A Part: CapEdge SPICE & FIT Software Search Our FAQs: KnowledgeEdge http://capacitoredge.kemet.com http://www.kemet.com/spice http://www.kemet.com/keask Location
Product Information
Resource Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Location
Product Request
Resource Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Location
Contact
Resource Website Contact Us Investor Relations Call Us Twitter www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir 1-877-MyKEMET http://twitter.com/kemetcapacitors Location
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we specifically disclaim – any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
16
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
KEMET Corporation World Headquarters
2835 KEMET Way Simpsonville, SC 29681 Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521
Europe
Southern Europe
Geneva, Switzerland Tel: 41-22-715-0100 Paris, France Tel: 33-1-4646-1009 Sasso Marconi, Italy Tel: 39-051-939111 Milan, Italy Tel: 39-02-57518176 Rome, Italy Tel: 39-06-23231718 Madrid, Spain Tel: 34-91-804-4303
Asia
Northeast Asia
Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585
Corporate Offices
Fort Lauderdale, FL Tel: 954-766-2800
North America
Southeast
Lake Mary, FL Tel: 407-855-8886
Southeast Asia
Central Europe
Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817
Northeast
Landsberg, Germany Tel: 49-8191-3350800 Dortmund, Germany Tel: 49-2307-3619672 Kwidzyn, Poland Tel: 48-55-279-7025
Wilmington, MA Tel: 978-658-1663 West Chester, PA Tel: 610-692-4642
Central
Schaumburg, IL Tel: 847-882-3590 Carmel, IN Tel: 317-706-6742
Northern Europe
Bishop’s Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Färjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000
West
Milpitas, CA Tel: 408-433-9950
Mexico
Zapopan, Jalisco Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1014-1 • 10/12/2010 17
Floating Electrode Design (FE-CAP), X7R Dielectric 6.3VDC-250VDC (Commercial & Automotive Grade)
Overview
KEMET’s Floating Electrode (FE-CAP) multilayer ceramic capacitor in X7R dielectric utilizes a cascading internal electrode design configured to form multiple capacitors in series within a single monolithic structure. This unique configuration results in enhanced voltage and ESD performance over standard capacitor designs while allowing for a fail-open condition if mechanically damaged (cracked). If damaged, the device may experience a drop in capacitance but a short is unlikely. The FE-CAP is designed to reduce the likelihood of a low IR or short circuit condition and the chance for a catastrophic and potentially costly failure event. Driven by the demand for a more robust and reliable component, the FE-CAP was designed for critical applications where higher operating temperatures and mechanical stress are a concern. These components are RoHS compliant, meet the requirements of the Automotive Electronics Council's AEC-Q200 and are widely used in automotive circuits as well as power supplies (input and output filters) and general electronic applications. Combined with the stability of an X7R dielectric, the FE-CAP complements KEMET’s “Open Mode” devices by providing a failsafe design optimized for low to mid range capacitance values. These devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C.
Benefits
• • • • • • • • • •
-55°C to +125°C operating temperature range Floating Electrode/fail open design Low to mid capacitance flex mitigation Pb-Free and RoHS compliant (excluding SnPb end metallization option) EIA 0402, 0603, 0805, 1206, 1210, & 1812 case sizes DC voltage ratings of 6.3V, 10V, 16V, 25V, 50V, 100V, 200V, & 250V Capacitance offerings ranging from 150pF to 0.22μF Available capacitance tolerances of ±5%, ±10% and ±20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated end metallization allowing for
excellent solderability • SnPb end metallization option available upon request (5% min) • Commercial and Automotive (AEC-Q200) grades available
Ordering Information
C
Ceramic
0805
Case Size (L" x W") 0402 0603 0805 1206 1210 1812
S
Specification/ Series S = Floating Electrode
104
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = ±5% K = ±10% M = ±20%
5
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 6 = 35V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
C
TU
Packaging/Grade (C-Spec)2
Failure Rate/ End Metallization 1 Design A = N/A
C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
1 2
Additional termination options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details.
One WORLD
One Brand
One Strategy
One Focus
One Team
One KEMET
C1014-1 • 10/12/2010 1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
T
W
L B
100% Tin or SnPb Plate
S
Nickel Plate Electrodes Conductive Metalization
EIA Size Code
0402 0603 0805 1206 1210 1812
Metric Size Code
1005 1608 2012 3216 3225 4532
L Length
1.00 (.040) ± 0.05 (.002) 1.60 (.063) ± 0.15 (.006) 2.00 (.079) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 4.50 (.177) ± 0.30 (.012)
W Width
0.50 (.020) ± 0.05 (.002) 0.80 (.032) ± 0.15 (.006) 1.25 (.049) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 3.20 (.126) ± 0.30 (.012)
B Bandwidth
0.30 (.012) ± 0.10 (.004) 0.35 (.014) ± 0.15 (.006) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.60 (.024) ± 0.35 (.014)
T Thickness
Mounting Technique
Solder Reflow Only Solder Wave or Solder Reflow Solder Reflow Only
See Table 2 for Thickness
Applications
Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website @www.aecouncil.com.
Environmental Compliance
Devices with “C” end metallization option are RoHS PRC ( Peoples Republic of China) compliant. Devices with “L” end metallization option do no meet RoHS criteria.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
2
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Operating Temperature Range: Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25ºC: Insulation Resistance (IR) Limit @ 25°C: -55°C to +125°C ±15% 3.5% 250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding 50mA) 5%(10V), 3.5%(16V & 25V) and 2.5%(50V to 200V) See Insulation Resistance Limit Table
Parameters/Characteristics
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
Insulation Resistance Limit Table
EIA Case Size
0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
1000 megohm microfarads or 100GΩ
N/A < .012µF < .047µF < .047µF < 0.22µF < 0.39µF ALL < 2.2µF ALL < 10µF ALL
500 megohm microfarads or 10GΩ
ALL ≥ .012µF ≥ .047µF ≥ .047µF ≥ 0.22µF ≥ 0.39µF N/A ≥ 2.2µF N/A ≥ 10µF N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
3
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 1A – (0402 - 0805 Case Sizes)
Cap
150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF
Cap Code
151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104
Series
Voltage Code Voltage DC Cap Tolerance J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Voltage DC Voltage Code M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M BB BB BB BB BB BB BB BB BB BB BB 9 6.3 8
C0402S
4 16 3 25 5 50 9 6.3 8 10 4 10
C0603S
3 25 5 50 1 100 2 200 9 6.3 8 10 4 16 16
C0805S
3 25 5 50 1 100 2 200 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC 200 2 A 250 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC 250 A
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 6.3 9 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 10 8 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 16 4 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 25 3 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG 50 5 DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD
200
100
Cap
Cap Code
9
8
4
3
5
9
8
4
3
5
1
2
Series
C0402S
C0603S
C0805S
C
Ceramic
0805
Case Size (L" x W") 0402 0603 0805 1206 1210 1812
S
Specification/ Series S = Floating Electrode
104
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = ±5% K = ±10% M = ±20%
5
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 6 = 35V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
C
TU
Packaging/Grade (C-Spec)2
Failure Rate/ End Metallization 1 Design A = N/A
C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
100 1
6.3
6.3
50
50
25
25
10
10
16
16
4
Roll Over for Order Info.
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 1B – (1206 - 1812 Case Sizes)
Cap
1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF
Cap Code
102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J
Series
Voltage Code Voltage DC Cap Tolerance K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Voltage DC Voltage Code M M M M M M M M M M M M M M M M M M M M M M M M M M M M M EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 9 6.3 8 10 4 16
C1206S
3 25 5 50 1 100 2 200 A 250 9 6.3 8 10 4 16
C1210S
3 25 5 50 1 100 2 200 A 250 9 6.3 8
C1812S
4 16 3 25 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 25 3 5 50 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 50 5 10 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 10 8
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 6.3 9
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 10 8
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 16 4
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 25 3
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 50 5
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FD
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC
GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 6.3 9
GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 16 4
200
200 2
250
Cap
Cap Code
9
8
4
3
5
1
2
A
1
Series
C1206S
C1210S
250 A
100
100
6.3
50
25
10
16
C1812S
C
Ceramic
0805
Case Size (L" x W") 0402 0603 0805 1206 1210 1812
S
Specification/ Series S = Floating Electrode
104
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = ±5% K = ±10% M = ±20%
5
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 6 = 35V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
C
TU
Packaging/Grade (C-Spec)2
Failure Rate/ End Metallization 1 Design A = N/A
C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
5
Roll Over for Order Info.
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness / Packaging Quantities
Thickness Code
AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF
Chip Size
01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225
Thickness ± Range (mm)
0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.05 0.80 ± 0.07 0.80 ± 0.10 0.80 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.25 ± 0.20 0.78 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.25 ± 0.15 1.60 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.50 ± 0.20 1.55 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 1.85 ± 0.20 1.85 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 2.25 ± 0.20 2.50 ± 0.20 0.80 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.30 ± 0.10 1.40 ± 0.15 1.50 ± 0.10 1.55 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.10 ± 0.15 1.15 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.70 ± 0.15 1.80 ± 0.15 2.40 ± 0.15 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.60 ± 0.20
Qty per Reel 7" Plastic
Qty per Reel 13" Plastic
Qty per Reel 7" Paper
15000 15000 10000 4000 4000 4000 4000 4000
Qty per Reel 13" Paper
50000 10000 10000 10000 10000 10000
Qty per Bulk Cassette
50000 15000
4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000
10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000
4000
10000
Package Quantity Based on Finished Chip Thickness Specifications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
6
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: • KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
EIA Size Code
01005 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
Metric Size Code
0402 0603 1005 1608 2012 3216 3225 4520 4532 4564 5650 5664
Density Level A: Maximum (Most) Land Protrusion (mm)
C 0.33 0.38 0.50 0.90 1.00 1.60 1.60 2.30 2.15 2.15 2.75 2.70 Y 0.46 0.56 0.72 1.15 1.35 1.35 1.35 1.75 1.60 1.60 1.70 1.70 X 0.43 0.52 0.72 1.10 1.55 1.90 2.80 2.30 3.60 6.90 5.50 6.90 V1 1.60 1.80 2.20 4.00 4.40 5.60 5.65 7.40 6.90 6.90 8.20 8.10 V2 0.90 1.00 1.20 2.10 2.60 2.90 3.80 3.30 4.60 7.90 6.50 7.90 C 0.28 0.33 0.45 0.80 0.90 1.50 1.50 2.20 2.05 2.05 2.65 2.60
Density Level B: Median (Nominal) Land Protrusion (mm)
Y 0.36 0.46 0.62 0.95 1.15 1.15 1.15 1.55 1.40 1.40 1.50 1.50 X 0.33 0.42 0.62 1.00 1.45 1.80 2.70 2.20 3.50 6.80 5.40 6.80 V1 1.30 1.50 1.90 3.10 3.50 4.70 4.70 6.50 6.00 6.00 7.30 7.20 V2 0.70 0.80 1.00 1.50 2.00 2.30 3.20 2.70 4.00 7.30 5.90 7.30 C 0.23 0.28 0.40 0.60 0.75 1.40 1.40 2.10 1.95 1.95 2.55 2.50
Density Level C: Minimum (Least) Land Protrusion (mm)
Y 0.26 0.36 0.52 0.75 0.95 0.95 0.95 1.35 1.20 1.20 1.30 1.30 X 0.23 0.32 0.52 0.90 1.35 1.70 2.60 2.10 3.40 6.70 5.30 6.70 V1 1.00 1.20 1.60 2.40 2.80 4.00 4.00 5.80 5.30 5.30 6.60 6.50 V2 0.50 0.60 0.80 1.20 1.70 2.00 2.90 2.40 3.70 7.00 5.60 7.00
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
7
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Ripple Current Terminal Strength Board Flex
Reference
Heat Generation ∆T : 20ºC max. JIS-C-6429 JIS-C-6429
Test or Inspection Method
Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve. (Ripple voltage must be < rated voltage) Appendix 1, Note: Force of 1.8kg for 60 seconds. Appendix 2, Note: 2mm (min) for all except 3mm for C0G. Magnification 50X. Conditions:
Solderability
J-STD-002
a) Method B, 4 hrs @ 155°C, dry heat @ 235°C b) Method B @ 215°C category 3 c) Method D, category 3 @ 260°C
Temperature Cycling Biased Humidity Moisture Resistance Thermal Shock High Temperature Life Storage Life Mechanical Shock Resistance to Solvents
JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 MIL-STD-202 Method 108 MIL-STD-202 Method 213 MIL-STD-202 Method 215
1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity: 1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. -55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes. Air-Air. 1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied. 150°C, 0VDC, for 1000 Hours. Figure 1 of Method 213, Condition F. Add aqueous wash chemical - OKEM Clean or equivalent.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
8
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
KE
ME
T
®
Embossed Plastic* or Punched Paper Carrier.
Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
Sprocket Holes
Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape
178mm (7.00") or 330mm (13.00")
Anti-Static Cover Tape (.10mm (.004") Max Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration (mm)
EIA Case Size
01005 - 0402 0603 - 1210 1805 - 1808 ≥ 1812 KPS 1210 KPS 1812 & 2220 Array 0508 & 0612
Tape size (W)*
8 8 12 12 12 16 8
Pitch (P1)*
2 4 4 8 8 12 4
*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1014-1 • 10/12/2010 9
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T T2 P2 ØDo Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
Ao F Ko B1 Bo E2 W
S1 T1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity
P1 ØD 1
Embossment For cavity size, see Note 1 Table 5
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) D0 D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 0.600 (0.024) T Max. T1 Max.
1.75 ± 0.10 (0.069 ± 0.004)
4.0 ± 0.10 (0.157 ± 0.004)
2.0 ± 0.05 (0.079 ± 0.002)
0.600 (0.024)
0.100 (0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm Pitch Single (4mm) Single (4mm) & Double (8mm) Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F 3.5 ± 0.05 (0.138 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) P1 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) T2 Max 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Max 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
10
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T ØDo P2 Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
A0
F E2 W
Bottom Cover Tape
B0
T1
P1
Top Cover Tape
T1
Center Lines of Cavity
Cavity Size, See Note 1, Table 7 Bottom Cover Tape
G
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm D0 1.5 +0.10-0.0 (0.059 +0.004, -0.0) E1 1.75 ±0.10 (0.069 ±0.004) P0 4.0 ±0.10 (0.157 ±0.004) P2 2.0 ±0.05 (0.079 ±0.002) T1Max 0.10 (.004) Max. G Min 0.75 (.030) R Ref. Note 2 25 (.984)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 8mm Pitch Half (2mm) Single (4mm) E2 Min 6.25 (0.246) F 3.5 ± 0.05 (0.138 ± 0.002) 2.0 ± 0.05 (0.079 ± 0.002) 4.0 ± 0.10 (0.157 ± 0.004) P1 T Max 1.1 (0.098) W Max 8.3 (0.327) 8.3 (0.327) A0 B 0 Note 5
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
11
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
Tape Width
8mm 12mm & 16mm
1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Peel Strength
0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum Component Rotation
° T
Maximum Component Rotation Top View
Typical Pocket Centerline
Maximum Component Rotation Side View
° s
Bo
Tape Width (mm) 8,12 16-200
Maximum Rotation ( 20 10
° T)
Typical Component Centerline
Ao
Tape Width (mm) 8,12 16-56 72-200
Maximum Rotation ( 20 10 5
° S)
Figure 4 – Maximum Lateral Movement
8mm & 12mm Tape
0.5 mm maximum 0.5 mm maximum
16mm Tape
1.0 mm maximum 1.0 mm maximum
Figure 5 – Bending Radius
Embossed Carrier Punched Carrier
R
Bending Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
12
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius, See Note Access Hole at Slot Location (Ø 40 mm min.)
W3 (Includes
flange distortion at outer edge)
W2 (Measured at hub) A D
(See Note)
C
(Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth
N W1 (Measured at hub)
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm A 178 ± 0.20 (7.008 ± 0.008) or 330 ± 0.20 (13.000 ± 0.008) B Min 1.5 (0.059) C 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) D Min 20.2 (0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm 50 (1.969) N Min 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) W1 W2 Max 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) W3 Shall accommodate tape width without interference
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
13
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier Punched Carrier 8 mm & 12 mm only Carrier Tape Round Sprocket Holes
END
START
Top Cover Tape
Elongated Sprocket Holes (32 mm tape and wider)
Trailer 160 mm minimum,
Top Cover Tape
Components
100 mm Min. Leader 400 mm Minimum,
Figure 8 – Maximum Camber
Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
14
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
6 8 ± 0.1 8 8 ± 0.1 12.0 ± 0.1
1.5 ± 2.0 ± 3.0 ±
0.1 0 0 0.1 0.2 0
53 3* 31.5 ± 0.2 0 36 ± 0 0.2 19.0*
10*
110 ± 0.7
5 0*
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters EIA Size Metric Size L Length Code Code
0402 0603 1005 1608 1.0 ± 0.05 1.6 ± 0.07
W Width
0.5 ± 0.05 0.8 ± 0.07
B Bandwidth
0.2 to 0.4 0.2 to 0.5
S Separation minimum
0.3 0.7
T Thickness
0.5 ± .05 0.8 ± .07
Number of Pcs/Cassette
50,000 15,000
Table 10 – Capacitor Marking
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)
Numeral Alpha Character
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y
Capacitance (pF) For Various Numeral Identifiers
9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000
Example shown is 1,000 pF capacitor
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
15
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
Other KEMET Resources
Tools
Resource Configure A Part: CapEdge SPICE & FIT Software Search Our FAQs: KnowledgeEdge http://capacitoredge.kemet.com http://www.kemet.com/spice http://www.kemet.com/keask Location
Product Information
Resource Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Location
Product Request
Resource Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Location
Contact
Resource Website Contact Us Investor Relations Call Us Twitter www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir 1-877-MyKEMET http://twitter.com/kemetcapacitors Location
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we specifically disclaim – any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1014-1 • 10/12/2010
16
SMD MLCCs – Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial & Automotive Grade)
KEMET Corporation World Headquarters
2835 KEMET Way Simpsonville, SC 29681 Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521
Europe
Southern Europe
Geneva, Switzerland Tel: 41-22-715-0100 Paris, France Tel: 33-1-4646-1009 Sasso Marconi, Italy Tel: 39-051-939111 Milan, Italy Tel: 39-02-57518176 Rome, Italy Tel: 39-06-23231718 Madrid, Spain Tel: 34-91-804-4303
Asia
Northeast Asia
Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585
Corporate Offices
Fort Lauderdale, FL Tel: 954-766-2800
North America
Southeast
Lake Mary, FL Tel: 407-855-8886
Southeast Asia
Central Europe
Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817
Northeast
Landsberg, Germany Tel: 49-8191-3350800 Dortmund, Germany Tel: 49-2307-3619672 Kwidzyn, Poland Tel: 48-55-279-7025
Wilmington, MA Tel: 978-658-1663 West Chester, PA Tel: 610-692-4642
Central
Schaumburg, IL Tel: 847-882-3590 Carmel, IN Tel: 317-706-6742
Northern Europe
Bishop’s Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Färjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000
West
Milpitas, CA Tel: 408-433-9950
Mexico
Zapopan, Jalisco Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1014-1 • 10/12/2010 17
